Multi-chip module

Details Multi-chip module Multi-chip module

1994-03-04

1997-05-20

Martin, David S.

Electrical transmission or interconnection systems

Plural supply circuits or sources

257 48, 257691, 307147, H01L 2358, H01L 2352

Patent

active

056315023

ABSTRACT:
A second power supply line 5 and a second ground line 6 are disposed along with a first power supply line 1 and a first ground line 2. An inner line 4 which connects a semiconductor chip IC1 and a semiconductor chip IC2 is connected to a second power supply line 5 and a second ground line 6 through respective resistors R1 and R2. The second power supply line 5 and the second ground line 6 are connected to outer terminals 15 and 16, not directly to the semiconductor chips IC1 and IC2, respectively.

REFERENCES:
patent: 4884122 (1989-11-01), Eichelberger et al.
patent: 4930002 (1990-05-01), Takenaka et al.
patent: 5231300 (1993-07-01), Terashima et al.
patent: 5272600 (1993-12-01), Carey
patent: 5347160 (1994-09-01), Sutrina
patent: 5393991 (1995-02-01), Kawakami

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