Microelectronic encapsulation methods and equipment

Details Microelectronic encapsulation methods and equipment Microelectronic encapsulation methods and equipment

1995-09-22

1998-06-16

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438127, H01L 2144

Patent

active

057669872

ABSTRACT:
Microelectronic assemblies such as semiconductor chip assemblies are encapsulated. During encapsulation, the terminals carried by a dielectric layer in each assembly, and the bottom surface of the semiconductor chip in each assembly are protected by covering layers. The covering layers confine the liquid encapsulant and prevent contamination of the terminals and chip bottom surfaces. The encapsulation process may be conducted by using a tilting fixture. The liquid encapsulant and the assemblies are placed into the fixture, the fixture is closed and evacuated, and the encapsulant is then poured onto the assemblies while maintaining the fixture under vacuum. The fixture is then pressurized and maintained under pressure during cure of the encapsulant.

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