Method and arrangement for reflow soldering and reflow unsolderi

Details Method and arrangement for reflow soldering and reflow unsolderi Method and arrangement for reflow soldering and reflow unsolderi

1987-06-30

1989-05-23

Godici, Nicholas P.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228219, 228232, 228242, 228264, 228 7, 228 9, 228 46, 219411, 219 8517, B23K 2900, B23K 120

Patent

active

048322490

ABSTRACT:
Method for reflow soldering respectively desoldering of circuit boards by using infrared radiation from radiator groups in a furnace. The circuit boards are introduced into the furnace on a timed belt or work piece carrier and maintained motionless during the prewarming, soldering respectively desoldering and cooling down phase. For prewarming for a first given time the radiator groups are operated with reduced operating current. For reflow soldering respectively desoldering the operating current of the radiator groups is switched for a second given time to a maaximum given stage and subsequently turned off completely. The soldered respectively desoldered circuit boards are cooled in a laminar air stream from ventilators for drawing off the solder vapors; the ventilators are initially operated with reduced number of rpms until the solder solidifies and then at the maximum number of rpms. Subsequently, the circuit boards are moved out of the furnace.

REFERENCES:
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patent: 3685139 (1972-08-01), Early et al.
patent: 3710069 (1973-01-01), Papadopoulos et al.
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 4231508 (1980-11-01), Wagner
patent: 4270260 (1981-06-01), Krueger
patent: 4364508 (1982-12-01), Lazzery et al.
patent: 4501072 (1985-02-01), Jacobi, Jr. et al.
patent: 4508960 (1985-04-01), Arai
patent: 4574182 (1986-03-01), Pescatore et al.
patent: 4654502 (1987-03-01), Furtek
"Research Disclosure", Solder Process Monitor, No. 258, Oct., 1985.

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