Semiconductor device on an opposed leadframe and method for maki

Details Semiconductor device on an opposed leadframe and method for maki Semiconductor device on an opposed leadframe and method for maki

1995-10-02

1997-05-20

Picardat, Kevin

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Having diverse electrical device

438107, H01L 2110

Patent

active

056311923

ABSTRACT:
A semiconductor device (10) is formed from a single leadframe (11) by aligning two electronic components (22,24) relative to each other. The leadframe (11) has two bonding regions (30,31), which are offset from each other, and interconnect bars (13) which are used to align the two bonding regions (30,31). After the electronic components (22,24) are mounted to their respective bonding regions (30,31), the interconnect bars (13) are bent downward or upward relative to the plane formed by the leadframe (11). The bending of the interconnect bars (13) will move the two electronic components (22,24) towards each other in the direction essentially parallel to the plane of the leadframe (11). A transparent mold (28) is then formed to encapsulate the electronic components (22,24). A body (29) is then formed around the transparent mold (28) and leads (19,20). A trim and form operation releases the semiconductor device (10) from the leadframe (11).

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