Plasma processing apparatus

Coating apparatus – Gas or vapor deposition – With treating means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118720, 118 501, 204164, C23C 1600

Patent

active

048319635

ABSTRACT:
A plasma processing apparatus which is effective for surface processing uses a reactive gas activated by plasma excited by microwave energy. Generation and maintaining of the plasma excited by the microwave energy are different where pressure in the gas chamber is above 0.1 Torr. Generating a high density plasma and maintaining the plasma includes the use of a protrudent window which extends into the activating chamber which also operates as a cavity resonator. Oxidation of resist formed on the surface of VLSI may be provided and damage by charge particles prevented by use of a magnetic field.

REFERENCES:
patent: 4101411 (1978-07-01), Suzuki et al.
patent: 4298419 (1981-11-01), Suzuki et al.
patent: 4401054 (1983-08-01), Matsuo et al.
patent: 4450031 (1984-05-01), Ono et al.
patent: 4559100 (1985-12-01), Ninomiya et al.
patent: 4585541 (1986-04-01), Miyake et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Plasma processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma processing apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1722919

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.