Food or edible material: processes – compositions – and products – Processes – Treatment or preparation of farinaceous dough – batter – or...
Patent
1999-05-10
2000-11-28
Yeung, George C.
Food or edible material: processes, compositions, and products
Processes
Treatment or preparation of farinaceous dough, batter, or...
99353, 99372, 99383, 426503, 426505, A21D 1300, A23P 100
Patent
active
061532436
DESCRIPTION:
BRIEF SUMMARY
The present invention concerns a method for manufacturing shaped wafers according to the preamble of claim 1.
Specifically, the present invention concerns the manufacture of wafers which are generally shaped, for example having a generally hemispherical cup or basin shape, rather than the usual flat form of wafers used, for example, to produce the filled biscuits generally known as wafer biscuits.
EP-A-0 054 229 and EP-A-0 221 033 describe solutions in which hemispherical wafer cups are obtained by a cutting operation from an intermediate product comprising a flat base from which the hemispherical cups project in the form of shaped pieces. Following the cutting operation, preferably performed in the general plane of the base, the hemispherical cups are separated from the base itself which is usually discarded.
The method used to obtain the aforesaid intermediate product usually comprises cooking in a mould, carried out with two complementary mould parts (for example, of cast iron) which define between them a space of constant, or substantially constant, thickness both in correspondence with the base and with the shaped parts. From GB-AL 751948 an arrangement is known wherein wafer products are baked between a mating pair of mould parts provided with complementary frustums, i.e. surfaces or areas in relief (e.g. ribs) and depressions, respectively. The angles between the side walls of said surfaces or areas in relief, on the one hand, and said depressions are chosen in such a way to render the wafer thicker at the top of the shaped parts than at the base thereof. The starting material is usually constituted by a mixture based on water, flour- or flours, sugar, flavorings etc: the respective recipes, which may be varied according to specific-, requirements of use, are widely known in the food industry and do not require description here, particularly as they are not in themselves relevant to an understanding of the invention.
The mixture (wafer paste) in question is applied in such a way that, when the two mould parts are closed, the mixture itself occupies the aforesaid space. The mould is then heated (the manner in which this is carried out is also widely known in the art) until the wafer is cooked to the desired degree. The subsequent opening of the mould makes available the aforesaid intermediate product from which the shaped wafers are cut.
Although fully satisfactory in relation to the problems it was originally intended to solve (for example, for the manufacture of pralines of the type described in EP-A-0 064 155 or EP-A-0 086 319), the solution described above encounters a number of difficulties whenever it is desired to produce thinner shaped wafers (for example, having a thickness of 1-1.5 mm instead of a typical thickness of approximately 2.5 mm in the case of the pralines mentioned above). This is found especially in industrial applications, when high through-puts are essential.
In the case of very thin wafers, the risk of the intermediate product breaking on removal from the mould increases and is, in fact, incompatible with the reliability and yield required for an industrial process.
The aim of the present invention is to modify the method described in the prior art so as to make it possible to manufacture wafers shaped, for example, as a basin and which are very thin (approximately 1-1.5 mm or, possibly, even thinner).
According to the present invention, this aim is achieved by a method having the characteristics claimed in claim 1. Advantageous developments of the invention form the subjects of sub-claims 2 to 5. The invention also concerns the related intermediate product having the characteristics claimed in claim 6 as well as the corresponding wafer having the characteristics claimed in claim 7. The invention also concerns a mould for carrying out the aforesaid method, having the characteristics according to claim 8. Advantageous developments of this mould form the subjects of claims 9 and 10.
The invention will now be described by way of non-limitative example, with reference to the acco
REFERENCES:
patent: 4458568 (1984-07-01), Cillario
Soremartec S.A.
Yeung George C.
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