Metal working – Method of mechanical manufacture – Electrical device making
Patent
1988-04-12
1989-05-23
Ramsey, Kenneth J.
Metal working
Method of mechanical manufacture
Electrical device making
29843, 228123, 2281731, 228155, H01L 2148, H01L 2160
Patent
active
048317233
ABSTRACT:
An electric circuit assembly (10) includes a ceramic substrate (14), a copper lead frame (20) having pad portions (22, 24, 26) directly bonded on the substrate, crimped portions (28, 30, 32) extending from the pad portions in a humped configuration above the substrate, and extension portions (34, 36, 38) extending from the crimped portions laterally beyond the substrate. The crimped portions prevent bonding of the extension portions to the substrate, to enable upward bending of the extension portions and crimped portions along bend lines (54) spaced laterally inwardly of the outer edge (18) of the substrate.
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"Over 50 Years of Experience with the Direct Bond Copper Process", Tegmen Corp., 1201 East Fayette Street, Syracuse, New York 13210.
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