Multichip module

Details Multichip module Multichip module

1996-12-20

2000-03-14

Whitehead, Jr, Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257700, 257704, 257787, H01L 310232

Patent

active

060376619

ABSTRACT:
A semiconductor device which includes a first semiconductor chip mounted on top of a lead frame which is molded within a plastic body. During the molding process a cavity is formed on the bottom of the lead frame. After testing or burn-in of the first chip a second semiconductor chip is mounted and electrically connected to the lead frame. The second chip may then be sealed within the cavity to form a multichip module.

REFERENCES:
patent: 5273938 (1993-12-01), Lin et al.
patent: 5295045 (1994-03-01), Kitano et al.
patent: 5318926 (1994-06-01), Dlugokecki et al.
patent: 5347429 (1994-09-01), Kohno et al.
patent: 5366933 (1994-11-01), Golwalkar et al.
patent: 5479051 (1995-12-01), Waki et al.
patent: 5523608 (1996-06-01), Kitaoka et al.
patent: 5793101 (1998-08-01), Kuhn

Affiliated with

Also associated with

Rating

Multichip module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multichip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multichip module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-172073