Method of manufacturing a multilayer ceramic electronic componen

Details Method of manufacturing a multilayer ceramic electronic componen Method of manufacturing a multilayer ceramic electronic componen

1996-05-22

1998-06-16

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156277, 264614, B32B 3126

Patent

active

057663920

ABSTRACT:
In order to inhibit a fired multilayer ceramic electronic component from delamination resulting from combustion of resin contained in conductive paste which is applied to internal conductors of the multilayer ceramic electronic component, the conductive paste is prepared by adding at least 1 percent by weight of terpene sulfide and/or mercaptan of R--SH in which R is a hydrocarbon radical having 8-16 carbon atoms to metal powder of Pd, Ag or Pd-Ag as an additive and kneading the same with an organic vehicle.

REFERENCES:
patent: 4748085 (1988-05-01), Fukuda et al.
patent: 4799983 (1989-01-01), Desai

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