Electronic package with heat transfer means

Details Electronic package with heat transfer means Electronic package with heat transfer means

1997-10-07

2000-03-14

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257706, 257712, 361705, H01L 2310, H01L 2334

Patent

active

060376589

ABSTRACT:
An electronic package including as part thereof a thermally conductive arrangement for restricting thermal fluid material motion about a heat-generating device, thereby assuring effective heat transference from the heat-generating device (e.g., module) to a cooling member (e.g., spaced heat sink), this arrangement preferably including: (1) a thermal fluid (e.g., thermal grease); and (2) structural elements (e.g., wire mesh, heat sink ridges, etc.). For restricting fluid movement, sealing structures (e.g., external gaskets) may be used to further assure fluid containment to a specified location. Pressure generation means (e.g., a plunger) can be used to increase fluid pressure when pressure droppages occur.

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.Energy Absorbing Foam Metals., Environmental Science and Technology, Los Alamos National Laboratory, Los Alamos, California.

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