Semiconductor integrated circuit device having short signal path

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

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Details

257787, 257700, 257678, 257704, 257710, H01L 2312, H01L 23053, H01L 2302, H01L 2310

Patent

active

060376562

ABSTRACT:
A ball grid array package provides conductive paths between terminals and a semiconductor chip through via-hole plugs formed in a circuit board, and the via-hole plugs are covered with a rigid plate before sealing the semiconductor chip in synthetic resin so as to prevent the via-hole plugs from penetration of the synthetic resin.

REFERENCES:
patent: 4530002 (1985-07-01), Kanai
patent: 4663215 (1987-05-01), Dubuisson et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5563446 (1996-10-01), Chia et al.
patent: 5736789 (1998-04-01), Moscicki
patent: 5808873 (1998-09-01), Celaya et al.

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