Semiconductor lead frame having multi-layered plating layer incl

Details Semiconductor lead frame having multi-layered plating layer incl Semiconductor lead frame having multi-layered plating layer incl

1998-03-24

2000-03-14

Crane, Sara

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257667, 257677, H01L 23495

Patent

active

060376538

ABSTRACT:
A semiconductor lead frame and a fabricating method thereof are provided. The semiconductor lead frame includes a metal substrate, and a multi-layered plating layer including a copper-nickel alloy layer formed on the metal substrate, and a palladium or palladium alloy layer formed on the copper-nickel alloy layer.

REFERENCES:
patent: 5001546 (1991-03-01), Butt
patent: 5750016 (1998-05-01), Moon

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