Method in an integrated circuit (IC) manufacturing process for i

Details Method in an integrated circuit (IC) manufacturing process for i Method in an integrated circuit (IC) manufacturing process for i

1997-02-26

1999-06-22

Assouad, Patrick

Data processing: measuring, calibrating, or testing

Testing system

Of circuit

36446828, 702 82, 702117, 438 14, G06F 1900, G06G 76466

Patent

active

059152311

ABSTRACT:
An inventive method of manufacturing IC devices from semiconductor wafers includes providing the wafers and fabricating IC's on the wafers. At probe, a unique fuse ID is stored in each IC, and an electronic wafer map is electronically stored for each wafer indicating the locations of good and bad IC's on the wafer and the fuse ID's of the IC's on the wafer. Each IC is then separated from its wafer to form an IC die, and the IC dice are assembled into IC devices. At the opens/shorts test at the end of assembly, the fuse ID of each IC device is automatically retrieved so the wafer map of the IC device may be accessed and evaluated to identify any IC devices containing bad IC's that have accidentally been assembled into IC devices. These "bad" IC devices are discarded, and the remaining IC devices continue on to back-end testing.

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