Method and apparatus for zero force part placement

Details Method and apparatus for zero force part placement Method and apparatus for zero force part placement

1992-08-14

1994-04-26

Evans, F. L.

Optics: measuring and testing

By polarized light examination

With light attenuation

356381, 356237, 33549, 33561, G01B 1102

Patent

active

053071492

ABSTRACT:
A method for part placement of a semiconductor chip for inspection where the semiconductor chip has a plurality of leads defining a seating plane and a body having a top. The method includes the steps of placing the body on a platform in an up position where the plurality of leads are suspended and probing the top of the body. Next measuring the position of the top of the body with reference to a predetermined coordinate system is done. Then the part is moved until the part is suspended on the plurality of leads on a reference plane. The top of the body is then probed for a second time, and the second position of the top of the body is measured with reference to the predetermined coordinate system. The thickness of the part is then determined as the distance between the top of the part and its seating plane.

REFERENCES:
patent: 4821157 (1989-04-01), Birk et al.
patent: 5114229 (1992-05-01), Hideshima
patent: 5208463 (1993-05-01), Honma et al.

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