Method for directly bonding ceramic and metal members and lamina

Stock material or miscellaneous articles – Composite – Of quartz or glass

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428469, 228122, B32B 1500

Patent

active

048492922

ABSTRACT:
A laminated body comprising a ceramic member and a metal member, and a method of forming the laminated body are described. The laminated body is characterized in that the ceramic member contains in its surface portion a bonding agent and the metal member is directly bonded to the surface of the ceramic member. The method of forming the laminated body is characterized in that a bonding agent-containing layer is first formed in the surface of the ceramic member and then the bonding agent-containing layer is heated while being contacted with the metal member.

REFERENCES:
patent: 3110571 (1963-11-01), Alexander
patent: 3993411 (1976-11-01), Babcock et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4050956 (1977-09-01), deBruin et al.
patent: 4129243 (1978-12-01), Cusano et al.
patent: 4540462 (1985-09-01), Mizunoya et al.
Burgess et al., the Direct Bonding of Metals to Ceramics by the Gas-Metal Eutectic Method, J. Electrochem. Soc. (U.S.A.), vol. 122, #5, May. 1975.
Chemical Abstracts, vol. 97, No. 6, Aug. 9, 1982, p. 259, No. 43115m, Columbus, Ohio, U.S.; & JP-A-82 47778 (Hitachi Ltd.) 18-03-1982 (Cat. Y).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for directly bonding ceramic and metal members and lamina does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for directly bonding ceramic and metal members and lamina, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for directly bonding ceramic and metal members and lamina will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-171280

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.