Flexibilizers of hydroxyphenyl silicone oil-epoxy resin product

Details Flexibilizers of hydroxyphenyl silicone oil-epoxy resin product Flexibilizers of hydroxyphenyl silicone oil-epoxy resin product

1992-05-29

1994-04-26

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525476, 525487, 525525, C08L 336, C08K 6114, C08K 6302, C08K 6304

Patent

active

053067479

ABSTRACT:
An epoxy resin composition for encapsulating a semiconductor device includes a flexibilizer constituted by a pre-reaction product of an epoxy resin and a modified silicone oil having hydroxyphenyl groups, as well as a flexibilizer constituted by a pre-reaction product of a phenol resin and a modified silicone oil having epoxy groups. Furthermore, an epoxy resin is used as a chief material, and a curing agent is added. The epoxy resin composition is heat resistant and moisture resistant, and has a low modulus of elasticity, a low coefficient of expansion, and a high glass transition temperature equivalent to or higher than that of a conventional epoxy resin composition.

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