Surface passivated semiconductor device and method for producing

Details Surface passivated semiconductor device and method for producing Surface passivated semiconductor device and method for producing

1978-06-14

1980-09-02

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 82, 427195, 357 72, H01L 2934, B05D 512, B05D 302

Patent

active

042209625

ABSTRACT:
Surface passivated semiconductor device including a semiconductor wafer in which a surface portion which intersects a pn-junction is covered with an organic passivation layer. The passivation layer consists of a partially fluorinated hydrocarbon polymer and is formed as a continuously molten coating which is produced by coating the surface portion with a powder which contains predominantly particles of a grain size less than 30.mu.. A method is provided for producing the device.

REFERENCES:
patent: 3310431 (1967-03-01), Loose
patent: 3684592 (1972-08-01), Chang
patent: 3920793 (1975-11-01), Teti
patent: 3936569 (1976-02-01), Miller
patent: 3958039 (1976-05-01), Yabuki
patent: 4013807 (1977-03-01), Putney
patent: 4017886 (1977-04-01), Tomono et al.

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