Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-07-20
1994-04-26
Heitbrink, Tim
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1563046, 1565831, 219494, 219765, 4251748R, B29C 6502
Patent
active
053063775
ABSTRACT:
A mold, having a mold cavity commensurate with the shaping, forming or welding to be made, includes an RF energized heater in close proximity to the mold cavity for heating plastic tubing placed within the mold cavity to a temperature sufficient to shape, form or weld the plastic tubing. An RF generator, electrically connected to the RF energized heater, monitors the power applied as a function of the temperature of the heater to heat the plastic tubing to a precise temperature. The mold is of thin wall construction with minimal thermal inertia to expedite both heating and cooling. Various configurations of the mold may be made to form tip shaping, forming or welding, butt welds, annular welds and the like to weld single thermoformable elements or join multiple thermoformable elements.
REFERENCES:
patent: 3322590 (1967-05-01), Clark
patent: 3387333 (1968-06-01), Irvine et al.
patent: 4186292 (1980-01-01), Acker
patent: 4390832 (1983-06-01), Taylor
patent: 4490598 (1984-12-01), Minney et al.
patent: 4571488 (1986-02-01), Reeves
patent: 4574173 (1986-03-01), Bennett
patent: 4575620 (1986-03-01), Ishii et al.
patent: 4582057 (1986-04-01), Auth et al.
patent: 4628168 (1986-12-01), Nebergall et al.
patent: 4641649 (1987-02-01), Walinsky et al.
patent: 4643186 (1987-02-01), Rosen et al.
patent: 4684789 (1987-08-01), Eggleston
patent: 4709698 (1987-12-01), Johnston et al.
patent: 4745263 (1988-05-01), Brooks
patent: 4754752 (1988-07-01), Ginsburg et al.
patent: 4755649 (1988-07-01), Barker et al.
patent: 4799479 (1989-01-01), Spears
patent: 4807620 (1989-02-01), Strul et al.
patent: 4808164 (1989-02-01), Hess
patent: 4860744 (1989-08-01), Johnson et al.
patent: 4954678 (1990-09-01), Harmony et al.
patent: 5006119 (1991-04-01), Acker et al.
patent: 5138136 (1992-08-01), Moreau et al.
patent: 5160396 (1992-11-01), Jansen et al.
patent: 5176866 (1993-01-01), Tanaka et al.
"Angioplasty--The Second Wave", Upside Magazine, Aug./Sep. 1990, pp. 63-66, by Dave Beal.
Jensen Joseph C.
Taylor Junius E.
Davis Robert B.
Engineering & Research Associates, Inc.
Heitbrink Tim
LandOfFree
Mold including a low thermal inertia heater and method of using does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mold including a low thermal inertia heater and method of using , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold including a low thermal inertia heater and method of using will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1709722