Sulfate-free electroless copper plating baths

Details Sulfate-free electroless copper plating baths Sulfate-free electroless copper plating baths

1992-11-20

1994-04-26

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 1838

Patent

active

053063368

ABSTRACT:
Sulfate-free electroless copper baths comprising cupric ions, formaldehyde, formate ions, hydroxyl ions, a copper counterion, e g. preferably a monovalent anion such as acetate, nitrate or formate, and copper chelant such as an alkali metal salt of aminotris(methylenephosphonic acid), biscarboxymethylaspartic acid, ethylenediaminetetra(methylenephosphonic acid), diethylenetriaminepenta(methylenephosphonic acid), gluconic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, mucic acid, D-saccharac acid, tartaric acid and N,N,N',N'-tetrakis(2-hydroxypropyl)ethylenediamine are amenable to the recovery of copper, e.g. from purge streams, using the methods and apparatus including solvent extraction, e.g. employing hydroxamic acid extractants, anion filtration, ion-exchange and chelant precipitation.

REFERENCES:
patent: 3793038 (1974-02-01), Maguire
patent: 4099974 (1978-07-01), Morishita et al.
patent: 4167601 (1979-09-01), Beckenbaugh et al.
patent: 4248633 (1981-02-01), Heijnen et al.
patent: 4279948 (1981-07-01), Kukanskis et al.
patent: 4301196 (1981-11-01), McCormack et al.
patent: 4303443 (1981-12-01), Miyazawa et al.
patent: 4450191 (1984-05-01), Arcilesi
patent: 4539044 (1985-09-01), Abu-Moustafa et al.
patent: 4814009 (1989-03-01), Kondo et al.
patent: 4834796 (1989-05-01), Kondo et al.

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