Semiconductor device with an insulation groove

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257759, 257760, H01L 23522, H01L 23532

Patent

active

056125720

ABSTRACT:
A semiconductor device comprising a semiconductor substrate, an insulation structure formed on the substrate and including a groove extending along a top surface of the insulation structure, and a wiring film formed lengthwise on the groove of the insulation film.

REFERENCES:
patent: 4176016 (1979-11-01), Koel et al.
patent: 4807016 (1989-02-01), Douglas
patent: 4949162 (1990-08-01), Tamaki et al.
patent: 4985740 (1991-01-01), Shenai et la.
patent: 5041397 (1991-08-01), Kim et al.
patent: 5164340 (1992-11-01), Chen et al.
patent: 5166088 (1992-11-01), Ueda et al.
patent: 5203957 (1993-04-01), Yoo et al.
patent: 5319246 (1994-06-01), Nagamine et al.
patent: 5332924 (1994-07-01), Kobayashi
"New Method of Making A1 Single Crystal Interconnections on Amorphous Insulators"; J. Wada, K. Suguro, N. Hayasaka and H. Okano, 31st Annunal Proceedings of Reliability Physics 1993, Atlanta, Georgia, Mar. 23-25, 1993, pp. 71-76.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device with an insulation groove does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device with an insulation groove, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with an insulation groove will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1708130

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.