Method for extending wafer-supporting sheet

Details Method for extending wafer-supporting sheet Method for extending wafer-supporting sheet

1993-04-27

1994-02-22

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437226, 148DIG28, H01L 2100

Patent

active

052886638

ABSTRACT:
In a method for extending a wafer-supporting sheet of a wafer-supporting table for dicing, the wafer-supporting sheet can be extended by using a single tool, and a total height of a wafer-supporting device can be reduced while the sheet is extended. In this wafer-supporting sheet extending method, a substantially C-shaped extension spring is arranged on a lower surface of the wafer-supporting sheet, on which a wafer divided into chips is placed, so that the sheet is extended. Thus, since the wafer-supporting sheet can be extended by a single tool (the C-shaped extension spring) and the extension spring can be made thin, the total height of the wafer-supporting device can be reduced while the sheet is extended.

REFERENCES:
patent: 3887996 (1975-06-01), Hartleroad et al.
patent: 4285433 (1981-08-01), Garrett, Sr. et al.
patent: 4543464 (1985-09-01), Takeuchi
patent: 4590667 (1986-05-01), Simon
patent: 4688540 (1987-08-01), Ono
patent: 4851371 (1989-07-01), Fisher et al.
patent: 5128282 (1992-07-01), Ormond et al.

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