Solder pad for printed circuit boards

Details Solder pad for printed circuit boards Solder pad for printed circuit boards

1994-08-10

1995-05-09

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361752, 361753, 361796, 361801, 174263, 174264, 174266, 174261, H05K 102

Patent

active

054142237

ABSTRACT:
An improved omni-directional non-occluding solder pad design for printed circuit boards comprising a plurality of spokes radiating outward from a through-hole on the printed circuit board, with a ring concentric to the through-hole that intersects each of the plurality of spokes at approximately a perpendicular angle. The ringed-spoke configuration eliminates the need to ensure proper orientation of the solder pad on the printed circuit board prior to a wave soldering process since the symmetrical ringed-spoke design is omni-directional. The concentric ring structure provides an additional contact area of solder between the printed circuit board and a computer chassis. This additional contact area of solder ensures that there is a sufficient electrical connection between the printed circuit board and the computer chassis such that when the printed circuit board is mounted to the computer chassis, a proper grounding connection is provided.

REFERENCES:
patent: 4543715 (1985-10-01), Iadarola et al.
patent: 4851614 (1989-06-01), Duncan, Jr.
patent: 5326937 (1994-06-01), Watanabe

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