Resistance heated, sealed microfabricated device package method

Details Resistance heated, sealed microfabricated device package method Resistance heated, sealed microfabricated device package method

1994-06-27

1995-05-09

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

53478, 174 524, H05K 506

Patent

active

054142148

ABSTRACT:
An apparatus (105, 301) for enclosing a microfabricated component (225) includes a package base (120, 405, 910), a package lid (110, 510, 950) and a seal (215) coupled to the package base (120, 405, 910) and to the package lid (110, 510, 950). The apparatus (105, 301) further includes a conductive loop (210, 610, 920) thermally coupled to the seal (215). Electrical energy is supplied to the conductive loop (210, 610, 920) to heat the conductive loop (210, 610, 920) and seal (215) to melt the seal (215) and thereby to seal the package base (120, 405, 910) to the package lid (110, 510, 950), providing a sealed environment for the microfabricated component (225).

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