Method of producing a semiconductor laser device

Fishing – trapping – and vermin destroying

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437124, 437133, 437906, H01L 2160

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active

056122586

ABSTRACT:
A semiconductor laser chip is fixed to a die bonding portion of a submount, an electrode of the semiconductor laser chip is connected to a wire bonding portion of the submount by a wire, and a coating film is formed on a light emitting end surface of the semiconductor laser chip under the state where a surface electrode of the submount is covered by a heat resistant tape.

REFERENCES:
patent: 4985370 (1991-01-01), Ponjee et al.
patent: 5024966 (1991-06-01), Dietrich et al.
patent: 5049527 (1991-09-01), Merrick et al.
patent: 5324387 (1994-06-01), Andrews et al.

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