Method of making flip-chip microwave integrated circuit

Details Method of making flip-chip microwave integrated circuit Method of making flip-chip microwave integrated circuit

1995-06-07

1997-03-18

Niebling, John

Fishing, trapping, and vermin destroying

437902, H01L 2160

Patent

active

056122578

ABSTRACT:
A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active devices have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.

REFERENCES:
patent: 4959705 (1990-09-01), Lemnios et al.
patent: 5202752 (1993-04-01), Honjo
patent: 5268315 (1993-12-01), Prasad et al.
patent: 5319237 (1994-06-01), Legros
patent: 5352998 (1994-10-01), Tanino
patent: 5373185 (1994-12-01), Sato
W.S. Wong, et al., "Flip Chip Manufacturing Technology for GaAs MMIC," Hughes Aircraft Company, Microelectronic Circuits Division, 1993 GaAs Mantech, Conf., pp. 224-227 Month Unknown.

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