Workpiece holding mechanism

Details Workpiece holding mechanism Workpiece holding mechanism

1997-02-10

1999-06-22

Scherbel, David A.

Abrading

Work holder

451397, 451287, B24B 4106

Patent

active

059137193

ABSTRACT:
A workpiece holding mechanism is used for holding a wafer. The wafer is sandwiched between a holding plate of the workpiece holding mechanism and a polishing pad attached to a polishing turn table. The workpiece is pressed against the polishing pad with a predetermined pressure so that the bottom surface of the wafer is polished. Water is confined within a fluid confinement space defined between an elastic membrane and the holding plate so as to press the wafer via the elastic membrane. There is provided a volume adjustment screw that can be advanced toward the fluid confinement space and be retracted therefrom. Through adjustment of the screw, the elastic membrane is caused to have a flat surface, so that the elastic member is in close contact with the entire surface of the wafer. A holding membrane made of polyurethane foam is bonded to the surface of the elastic membrane, and a template is bonded to the surface of the holding membrane so as to improve the holding performance. Accordingly, a uniform pressure can be applied onto the wafer during polishing, and the wafer is prevented from shifting from a desired position even when polishing is performed at a high speed.

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patent: 5588902 (1996-12-01), Tominaga et al.
patent: 5643053 (1997-07-01), Shendon
patent: 5670011 (1997-09-01), Togawa et al.

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