Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-09-29
1997-03-18
Sells, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156235, 156238, 156239, 1562755, 1563077, 1563798, 264405, B32B 3100
Patent
active
056118805
ABSTRACT:
A method of photoforming a three-dimensional object, comprising the steps of transferring onto a work table a semi-hardened layer of a photohardenable resin separably supported on a base film, photoforming a hardened layer by exposing the semi-hardened layer, the hardened layer being laminated on a previously hardened layer to photoform the three-dimensional object, and when the hardened layer is photoformed, photoforming a first-region hardened layer forming the three-dimensional object and also a second region hardened layer that is adjacent to the first-region hardened layer through a predetermined space, the first-region hardened layer being supported through a portion of the semi-hardened layer by the second-region hardened layer.
An apparatus for photoforming a three-dimensional object, comprising a transfer unit for transferring onto a work table a semi-hardened layer of a photohardenable resin separably supported on a base film, and an irradiation unit for photoforming a hardened layer by exposing the semi-hardened layer, the hardened layer being laminated on a previously hardened layer to photoform the three-dimensional object.
REFERENCES:
patent: 4801477 (1989-01-01), Fudim
patent: 4961154 (1990-10-01), Pomerantz
patent: 5015312 (1991-05-01), Kinzie
patent: 5059266 (1991-10-01), Yamane et al.
patent: 5122441 (1992-07-01), Lawton
patent: 5135379 (1992-08-01), Fudim
patent: 5143817 (1992-08-01), Lawton
patent: 5171490 (1992-12-01), Fudim
patent: 5175077 (1992-12-01), Grossa
patent: 5183598 (1993-02-01), Nelle 264 22
Sells James
Teijin Seiki Co. Ltd.
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