Method for separating bonded substrates, in particular disassemb

Details Method for separating bonded substrates, in particular disassemb Method for separating bonded substrates, in particular disassemb

1992-11-12

1993-12-14

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

1562728, 156643, 156668, 359 80, B32B 3500

Patent

active

052698688

ABSTRACT:
A method for separating bonded substrates which are prepared by facing a plurality of substrates and bonding the substrates by an adhesive features irradiating an energy beam on the bonding portions of the bonded substrates from above one of the bonded substrates to separate the one substrate and the other substrate. The energy beam has the property of being transmitted through the one substrate and of being absorbed into the adhesive.

REFERENCES:
patent: 2884312 (1959-04-01), Kuryla
patent: 3411971 (1968-11-01), Wood
patent: 3735911 (1973-05-01), Ward
patent: 3885072 (1975-05-01), Zibritosky
patent: 3939556 (1976-02-01), Borel et al.
patent: 4297401 (1981-10-01), Chern et al.
patent: 4588468 (1986-05-01), McGinty et al.
patent: 4684437 (1987-08-01), Donelon et al.
patent: 4718967 (1988-01-01), Irie
patent: 5037780 (1991-08-01), Fujimoto et al.
patent: 5098501 (1992-03-01), Nishiguchi
J. Opt. Soc. Am. B/vol. 3, No. 5, May 1986, pp. 792-795, P. E. Dyer et al., "Direct-Etching Studies of Polymer Films Using A 157-nm F.sub.2 Laser".
"Ablative Photodecomposition: Action of Far-Ultraviolet (193 mm) Laser Radiation on Poly(ethylene terephthalate) Films", J. Am. Chem. Soc., Aug. 2, 1982, 104, 6784-6785, R. Srinivasan et al.
"Self-Developing Photoetching of Poly(ethylene terephthalate) Films by Far-Ultraviolet Excimer Laser Radiation", Appl. Phys. Lett., vol. 41, No. 6, Sep. 15, 1982, pp. 576-578, R. Srinivasan et al.

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