Connector module with molded upper section including molded sock

Details Connector module with molded upper section including molded sock Connector module with molded upper section including molded sock

1995-08-16

1997-03-18

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439925, H01R 2900

Patent

active

056116977

ABSTRACT:
An interface connector device having two assemblies for interconnecting a plurality of input/output devices to a multi-wire bus. The first assembly is electrically connected directly to the multi-wire bus and the second is carried on the first assembly and supports an IC chip. The second assembly includes electrical connections for connecting the input and output devices to the IC chip and for connecting the multi-wire bus to the IC chip for conveying the signals between the multi-wire bus and the input and output devices. The second assembly incorporates a single molded piece including a molded socket for receiving the IC chip, a set of molded pins adapted to receive conductive coatings for electrically connecting the input and output devices to the IC chip, and molded positioning elements for orienting the second assembly with respect to the first assembly.

REFERENCES:
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patent: 4727456 (1988-02-01), Mehta et al.
patent: 5037308 (1991-08-01), Bryce
patent: 5044964 (1991-09-01), Minerd et al.
patent: 5104327 (1992-04-01), Walburn
patent: 5125846 (1992-06-01), Sampson
patent: 5181852 (1993-01-01), Dambach et al.
patent: 5299942 (1994-04-01), Burke et al.
patent: 5415556 (1995-05-01), Schroll
patent: 5452183 (1995-09-01), Renn et al.

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