Method of providing stress-free thermally-conducting attachment

Details Method of providing stress-free thermally-conducting attachment Method of providing stress-free thermally-conducting attachment

1989-01-25

1991-09-24

Larkins, William D.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

16510433, H01L 2340

Patent

active

050518143

ABSTRACT:
A body having a surface for facilitating liquid adherence includes a substrate and a layer of etchable material on a surface of the substrate. Grooves having re-entrant surfaces are formed in the layer of material. In one embodiment, a heat sink for a semiconductor integrated circuit includes a heat-conducting body having a major surface and a grooved layer of a polymer on the major surface. The layer of polymer is encased in a metal layer which provides strength and electrical and thermal conductance. Reactive ion etching can be employed to form the grooves in the polymer, and metal sputtering and electroless plating can be employed to form a composite metal layer.

REFERENCES:
patent: 3953877 (1976-04-01), Sigusch et al.
patent: 4376287 (1983-03-01), Sechi
patent: 4567505 (1986-01-01), Pease et al.

Affiliated with

Also associated with

Rating

Method of providing stress-free thermally-conducting attachment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of providing stress-free thermally-conducting attachment , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of providing stress-free thermally-conducting attachment will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1700781