Semiconductor device using a tape carrier

Details Semiconductor device using a tape carrier Semiconductor device using a tape carrier

1990-05-31

1991-12-03

James, Andrew J.

357 80, 357 74, 357 68, H01L 2348

Patent

active

050703900

ABSTRACT:
A semiconductor device comprising a chip having a plurality of electrodes, a lead frame including a plurality of leads, a tape carrier having an insulative base film and a plurality of conductive patterns formed on the base film, one of the conductive patterns being used as a ground line. The electrodes of the chip are electrically connected to the respective leads of the lead frame via the respective conductive patterns of the tape carrier, a molded resin is used for hermetically and integrally sealing at least the chip and the tape carrier, and a conductive pad is arranged in the vicinity of the conductive patterns of the tape carrier and is electrically connected to the ground line to constitute a microstrip circuit.

REFERENCES:
patent: 3364440 (1968-01-01), Granberry
patent: 3777221 (1973-12-01), Tausko et al.
patent: 3784883 (1974-01-01), Duncan et al.
patent: 4812421 (1989-03-01), Jung et al.
patent: 4916519 (1990-04-01), Ward
patent: 4922324 (1990-05-01), Sudo

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