Metal working – Method of mechanical manufacture – Electrical device making
Patent
1986-04-02
1989-04-04
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29846, 29848, 29852, 4273762, 501119, 501128, H05K 312, C04B 3510, C04B 3518
Patent
active
048172766
ABSTRACT:
A ceramic substrate for densely integrated semiconductor arrays which is superior in a coefficient of thermal expansion, dielectric constant, strength of metallized bond, and mechanical strength, comprising a sintered body composed essentially of mullite crystals and a non-crystalline binder composed of SiO.sub.2, Al.sub.2 O.sub.3, and MgO, is provided.
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patent: 4620264 (1986-10-01), Ushifusa et al.
patent: 4734233 (1988-03-01), Todd et al.
Journal of Material Science, vol. 19, No. 3, Mar. 1984, pp. 838-844, London, GB; G. Celotti, et al.; "Structural and Morphological Characterization of Mullitic Substrates Obtained by Dry-Pressing", * page 839, Middle of Right-Hand Column*.
Mussler, Bernard and Shafer, M, "American Ceramic Society, Ceramic Bulletin", vol. 63, No. 5 (1984), pp. 705-710 & 714.
Mazdiyasni, K. and Brown, L. "Journal of the American Ceramic Society", 55(11), 1972, pp. 548-552.
Fujita Tsuyoshi
Ishihara Shousaku
Kanda Naoya
Kuroki Takashi
Toda Gyozo
Echols P. W.
Hitachi , Ltd.
Ross Taylor J.
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