Coating processes – Electrical product produced
Patent
1989-11-09
1991-09-24
Thomas, Alexander S.
Coating processes
Electrical product produced
427 82, 427 96, 428 68, 428 76, 428447, 357 72, B32B 3126
Patent
active
050512757
ABSTRACT:
An electronic device is encapsulated by a curable material which, prior to cure, consists essentially of (a) 33 to 39 percent of a silicone resin selected from the group consisting of (i) polydimethylsiloxane, containing a platinum catalyst and having functional components selected from the group consisting of vinyl and hydride functional components, (ii) polymethylphenylsiloxane containing a platinum catalyst and having functional components selected from the group consisting of vinyl and hydride functional components, and (iii) a mixture of (i) and (ii), (b) 51 to 57 weight percent of silicon dioxide and (c) 8 to 12 weight percent of a low vapor pressure organic solvent, preferably an alcohol ester.
REFERENCES:
patent: 4564562 (1986-01-01), Wong
patent: 4592959 (1986-06-01), Wong
patent: 4888226 (1989-12-01), Wong
"An Overview of Integrated Circuit Device Encapsulants", by C. P. Wong, Journal of Electronic Packaging, vol. 111, Jun. 1989, pp. 97-107.
"High-Performance Silicone Gel as Integrated-Circuit-Device Chip Protection", by C. P. Wong in ACS Symposium Series 407, Polymeric Materials for Electronics Packaging and Interconnection, edited by J. H. Lupinski and R. S. Moore, (American Chemical Society, 12/1989), pp. 220-229.
Anderson R. B.
AT&T Bell Laboratories
Thomas Alexander S.
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