Semiconductor wafer-processing apparatus

Details Semiconductor wafer-processing apparatus Semiconductor wafer-processing apparatus

1989-03-23

1991-12-03

Basinger, Sherman

Material or article handling

Chamber of a type utilized for a heating function and...

Including driven device and/or inclined flow path to carry...

414180, 432 6, 432152, 432253, F27D 500

Patent

active

050695916

ABSTRACT:
A semiconductor wafer-processing apparatus has a plurality of support members provided respectively for the processing units of a processing apparatus, and designed for supporting wafer receptacles each containing semiconductor wafers, and receptacle-inserting/extracting mechanism for inserting a wafer receptacle from the support members into the processing units, and for extracting the wafer receptacle from the processing units back to the support members. Receptacle-transporting mechanism is provided, operated independently of the receptacle inserting/extracting mechanism, for transporting the wafer receptacle between each support member and a predetermined position.

REFERENCES:
patent: 4468195 (1984-08-01), Sasaki et al.
patent: 4669938 (1987-06-01), Hayward
patent: 4767251 (1988-08-01), Whang
patent: 4872799 (1989-10-01), Fisher, Jr.
patent: 4954079 (1990-09-01), Yamaga

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