Method for bonding semiconductor chips

Details Method for bonding semiconductor chips Method for bonding semiconductor chips

1975-01-17

1976-06-15

Drummond, Douglas J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29626, 156299, H05K 300

Patent

active

039635511

ABSTRACT:
Apparatus and method for the uniform dipensing of a conductive epoxy binder in hybrid microcircuit applications. A method is disclosed of uniformly pressurizing a conductive epoxy binder through a small orifice until a droplet of fixed volume forms, setting a predetermined gap size between a contact pad and the droplet in order to control the shape and size of the epoxy droplet left on the pad as the droplet touches it, and then releasing the pressure while reciprocating the dispenser from the pad. Also, apparatus, including a cylindrical limiting means attached to the dispenser tip, is disclosed for ensuring the gap size is constant. Other embodiments of the limiting means provide for the use of a relieved section which assists in preventing contamination and for adjusting means operable to vary the gap size.

REFERENCES:
patent: 2678557 (1954-05-01), Black
patent: 3572400 (1971-03-01), Casner et al.
patent: 3715258 (1973-02-01), Cunnane
patent: 3810779 (1974-05-01), Pickett et al.
patent: 3834966 (1974-09-01), Kelly

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