Method of manufacturing a printed circuit assembly

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29825, 156310, H05K 336

Patent

active

058391886

ABSTRACT:
A printed circuit assembly and method of making the same utilize in one embodiment an adhesive layer including a plurality of non-conductive "gauge particles" disposed within a non-conductive adhesive. When the adhesive layer is disposed between opposing printed circuit layers (be they insulating substrates, conductive layers, or other layers), individual gauge particles are interposed or sandwiched at various points between the layers such that the diameters of the particles control the layer separation throughout overlapping areas of thereof, thereby permitting careful control over layer separation. A printed circuit assembly and method of making the same utilize in another embodiment an interlayer interconnecting technology incorporating conductive posts that are deposited on one of a pair of contact pads formed on opposing printed circuit boards and thereafter bonded to the other in the pair of contact pads during lamination. Fusible material may be utilized in the conductive posts to facilitate mechanical bonding to a contact pad, and the posts project through a dielectric layer disposed between the printed circuit boards, thereby forming the electrical connections between the boards at discrete locations.

REFERENCES:
patent: 3835531 (1974-09-01), Luttmer
patent: 4157932 (1979-06-01), Hirata
patent: 4814040 (1989-03-01), Ozawa
patent: 4991285 (1991-02-01), Shaheen et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5318651 (1994-06-01), Matsui et al.
patent: 5329695 (1994-07-01), Traskos et al.
patent: 5401913 (1995-03-01), Gerber et al.
patent: 5431571 (1995-07-01), Hanrahan et al.
patent: 5457881 (1995-10-01), Schmidt
patent: 5545281 (1996-08-01), Matsui et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a printed circuit assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a printed circuit assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a printed circuit assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1692092

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.