High temperature-resistant conductive adhesive and method employ

Details High temperature-resistant conductive adhesive and method employ High temperature-resistant conductive adhesive and method employ

1978-12-20

1980-11-11

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29589, 75134T, 156299, 252511, 252514, 260 37M, 428328, 428554, 4284735, 528335, 228123, 228238, C09J 500, B32B 3100

Patent

active

042331030

ABSTRACT:
A high temperature-resistant, conductive adhesive composition for bonding a semiconductor die to a substrate comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a polyimide resin.

REFERENCES:
patent: 3073784 (1963-01-01), Endrey
patent: 3576691 (1971-04-01), Meyers
patent: 3677974 (1972-07-01), Kilduff
patent: 4147669 (1979-04-01), Shaheen et al.
Melan et al., "Electrically Conductive Adhesive", IBM Technical Disclosure Bulletin, vol. 8, No. 9, 2-1966.

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