Hinge incorporating a helically coiled heat pipe for a laptop co

Details Hinge incorporating a helically coiled heat pipe for a laptop co Hinge incorporating a helically coiled heat pipe for a laptop co

1997-08-06

1999-06-08

Feild, Lynn D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 86, 16510433, G06F 120, H05K 720

Patent

active

059108835

ABSTRACT:
An arrangement and method for enhancing the cooling capacity of portable personal computers. The power dissipation of portable personal computers (PCs) is increased by conducting heat through a heat pipe arranged in a hinge structure interconnecting a display panel with a bottom keyboard housing, and conducting the heat into an area at the rear of the display panel.

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patent: 5331510 (1994-07-01), Ouchi et al.
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patent: 5513070 (1996-04-01), Xie et al.
patent: 5621613 (1997-04-01), Haley et al.
patent: 5732765 (1998-03-01), Drolen et al.
Albert Yu, "The Future of Microprocessors", IEEE Micro, Dec. 1996, pp. 46-53.

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