Carrier having interchangeable substrate used for testing of sem

Details Carrier having interchangeable substrate used for testing of sem Carrier having interchangeable substrate used for testing of sem

1993-09-21

1996-02-27

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 3102, G01R 3126

Patent

active

054951798

ABSTRACT:
A carrier for testing a singularized semiconductor die prior to packaging the die utilizes a removable die supporting substrate. The die is placed in the carrier and is electrically connected to the substrate, thereby allowing for the packaging or other use of only known good die. A bridge clamp presses against a rigid cover which, in turn, bias the die against a plurality of die contacting members located on the die supporting substrate. The use of the removable die supporting substrate permits a single carrier design to accommodate different die types and further permits handling equipment to mechanically handle the one carrier design. This facilitates the handling of the carrier so that the carrier can be conveniently used during burn-in and test procedures.

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