Mask containing subresolution line to minimize proximity effect

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430 30, G03F 900

Patent

active

060226447

ABSTRACT:
A electrical connection structure pattern according to the present invention includes a relatively dense first electrical connection structure area to a second electrical connection structure area. First, the electrical connection structure pattern is expensed to generate a first dummy pattern. The area of the first dummy pattern is larger than that of electrical connection structure pattern. Next, a second dummy pattern is generated by narrowing the line width of the first dummy pattern. A third dummy pattern is obtained by using CAD. The area of the third dummy pattern is smaller than that of the second dummy pattern, but larger than that of the electrical connection structure pattern. A fourth dummy pattern is generated by using CAD to remove the overlap area between the second dummy pattern and the third dummy pattern.

REFERENCES:
patent: 5879844 (1999-03-01), Yamamoto et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Mask containing subresolution line to minimize proximity effect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mask containing subresolution line to minimize proximity effect , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mask containing subresolution line to minimize proximity effect will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1679495

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.