Method of forming electrode wirings in semiconductor devices

Details Method of forming electrode wirings in semiconductor devices Method of forming electrode wirings in semiconductor devices

1976-08-18

1978-02-28

Kendall, Ralph S.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 99, 427250, 427259, 156656, 156661, B05D 132, B05D 512, C23C 1302

Patent

active

040768600

ABSTRACT:
A method of forming electrode wirings for semiconductors devices. A first photoresist pattern is formed on the surface to be provided with electrode wirings in the configuration of an inverse pattern to the electrode wirings, and on the top of this pattern-containing surface is vapor deposited, a conductor of electrode material. On the conductor layer, a second photoresist layer is applied. This photoresist layer is etched until only the upper surface of the part of the conductor layer located above the first photoresist pattern, is exposed, thereby forming a second photoresist pattern. Then, by etching the aforementioned conductor layer with this second photoresist patterns as the etching mask, only the part of the conductor layer which is not to constitute the electrode wirings is removed. By this method, thicker electrode wirings than those formed by the conventional lift-off method may readily be formed.

REFERENCES:
patent: 2989385 (1961-06-01), Gianola
patent: 3115423 (1963-12-01), Ashworth
patent: 3725743 (1973-04-01), Murayama
patent: 3794536 (1974-02-01), Muska
patent: 3957552 (1966-05-01), Ahn

Affiliated with

Also associated with

Rating

Method of forming electrode wirings in semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming electrode wirings in semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming electrode wirings in semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1676977