Structure of joining printed circuit boards and process for prod

Details Structure of joining printed circuit boards and process for prod Structure of joining printed circuit boards and process for prod

1988-12-05

1990-08-21

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Edge feature

428209, 428901, 2281802, 228254, 174250, 361397, 361398, 361414, B32B 900

Patent

active

049505270

ABSTRACT:
A structure of joining two printed circuit boards with solder. A reserve solder layer is applied on a pattern of joint leads of the printed circuit on a base plate of the first board. A similar pattern of high thermal conductivity to the pattern of joint leads of the second printed circuit board is formed on the opposite or back surface of the base plate thereof in almost or exact coincidence with the latter. To join the first and second boards, the latter is turned upside down and then its joint lead pattern is put on the solder layer in registry with that of the first board. And it is at a point on each patch of the thermal conductivity pattern that heat is then applied thereto to obtain the structure between the joint leads of the two printed circuit boards.

REFERENCES:
patent: 4316320 (1982-02-01), Nogawa et al.
patent: 4657172 (1987-04-01), Lee

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