Service temperature connector and packaging structure of semicon

Details Service temperature connector and packaging structure of semicon Service temperature connector and packaging structure of semicon

1986-03-24

1990-08-21

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

439 74, 439161, 439342, H01R 909

Patent

active

049501739

ABSTRACT:
The present invention discloses a connector comprising: an insulating substrate having a plurality of through-holes and having a desired first circuit pattern formed on the substrate; female contactors each being formed and fixed around the edge of the through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor comprising an insulating substrate having a desired second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transition temperature.

REFERENCES:
patent: 3619478 (1971-11-01), Staiger
patent: 3670409 (1972-06-01), Reimer
patent: 4138604 (1979-02-01), Harmsen et al.
patent: 4487465 (1984-12-01), Cherian
IBM Bulletin, Roche et al, vol. 6, No. 8, p. 87, 1-1964.
IBM Bulletin, Skinner, vol. 12, No. 3, p. 467, 8-1969.
IBM Bulletin, Hoffman et al, vol. 13, No. 9, p. 2475, 2-1971.
IBM Bulletin, Hinkley et al, vol. 9, No. 7, p. 766, 12-1966.
IBM Bulletin, Kryzaniwsky, vol. 14, No. 9, p. 2599, 2-1972.

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