Print circuit board

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1986-03-12

1987-11-03

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428462, 428521, 428901, 174 685, B32B 300, B32B 1508, B32B 2732, H05K 100

Patent

active

047043180

ABSTRACT:
There is disclosed a wiring substrate comprising a wiring circuit pattern formed on a metal substrate with an insulating resinous layer interposed therebetween. In this wiring substrate, the insulating resinous layer is formed of a high molecular composition comprising thermosetting 1,2-polybutadiene containing 5 to 30% by weight of a high molecular softening agent such as hydrogenated polybutadiene. A method of manufacturing such a wiring substrate is also disclosed, wherein a light-reflecting pigment is included in the insulating resinous layer for the convenience of the subsequent laser trimming.

REFERENCES:
patent: 3704207 (1972-11-01), Burtis
patent: 3947801 (1976-03-01), Bube
patent: 4072792 (1978-02-01), Araki et al.
patent: 4091157 (1978-05-01), Hori et al.
patent: 4243462 (1981-01-01), Hori et al.
patent: 4311759 (1982-01-01), Glennon
patent: 4326238 (1982-04-01), Takeda et al.
patent: 4499149 (1985-02-01), Berger
patent: 4522888 (1985-06-01), Eichelberger et al.
patent: 4568592 (1986-02-01), Kawaguchi et al.
Electronic Design, vol. 30, No. 4, Feb. 1982, pp. 209-216, Denville, US; H. Winard: "Focus on Thick Films: Base Metals and Polymers Loom Large".

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