Method of constructing stacked packages

Details Method of constructing stacked packages Method of constructing stacked packages

1997-03-10

1999-11-30

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438109, 438455, 438928, 257686, 257723, 257778, 29840, H01L 2144, H01L 2148, H01L 2150

Patent

active

059941669

ABSTRACT:
A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip on board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

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