Method of producing an aluminum film

Details Method of producing an aluminum film Method of producing an aluminum film

1997-05-28

1999-11-30

King, Roy V.

Coating processes

With post-treatment of coating or coating material

Heating or drying

4273743, 4273833, 427 96, 427124, 427250, 427566, 427409, 20419217, 438660, 438927, B05D 302, B05D 512

Patent

active

059939087

ABSTRACT:
A method of producing an aluminum film on a substrate, from which very narrow aluminum conductor tracks can be created that are highly resistant to electromigration and/or stress migration. The substrate with the polycrystalline aluminum film is cooled in an oven in a controlled fashion from a target temperature to a final temperature such that energetically stable Al.sub.2 Cu-.theta.-phases are formed directly among the individual aluminum grains in the aluminum film. The cooling is controlled such that the instantaneous temperature passes through a predetermined temperature profile. Within the range of 320.degree. C. to 200.degree. C., the cooling gradient is less than 6.degree. C. per hour.

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"Comparison of Mechanical Properties and Microstructure of A1(1 wt.%Si) and A1(1wt.%Si, 0.5 wt. % Cu) thin Films" (Bader et al.), 1995 Elsevier Science, Thin Solid Films, pp. 175-184; No month data!.
"The Effect of Cu Alloying on Al Alloy Thim Films: Microstructural Mechanisms that enhance Electromigration Resistance" (Frear et al.), Microelectronics III Symposium, San Francisco, CA, Apr. 1993, pp. 349-367.
"The Evolution of Microstructure in A1-2 Pct Cu Thin Films: Precipitation, Dissolution, and Reprecipitation" (Prear et al.), vol. 21 A, Sep. 1990, pp. 2449-2459.
"Materials Reliability in Microelectronics III" (Rodbell), Mat. Res. Soc Symp. Proc. vol. 309, 1993 Materials Research Society, pp. 384-394 No month data!!.

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