Low shrink thermosetting polyesters

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

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Details

260 23P, 260 40R, 260861, 260862, 260863, C08L 6708

Patent

active

RE0295558

ABSTRACT:
This invention pertains to a one-component, low shrink molding resin system comprising a thermoplastic, branched alkyd in combination with a thermosetting dicyclopentadiene modified polyester resin. The low shrink molding resin systems are stabilized dispersions wherein the branched thermoplastic alkyd is dispersed within the dicyclopentadiene polyester resin (polyester polymer + monomer) to provide a uniform dispersion. The low shrink molding resin system can be thickened with alkaline earth and/or hydroxide thickeners suitable for use in low shrink molding compositions for producing low-profile molded parts.

REFERENCES:
patent: 2973331 (1961-02-01), Kraft
patent: 3347806 (1967-10-01), Zimmermann
patent: 3549586 (1970-12-01), Smith et al.
patent: 3736278 (1973-05-01), Wada et al.
patent: 3883612 (1975-05-01), Pratt et al.
patent: 3923927 (1975-12-01), Miyake et al.

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