Low temperature activating adhesives for laminating plastic film

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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260 328N, 428458, 428460, 428480, 525411, 525415, 525417, 525440, 4284242, C08L 7506

Patent

active

042502748

ABSTRACT:
Improved adhesive compositions for laminating plastic and particularly vinyl films to metal are described which contain about 15 to 30 percent by weight of a phenolic resol having a methylol content of about 15 to 50 percent by weight, about 25 to about 40 percent by weight of certain nonfunctional polyurethanes having a molecular weight of at least 20,000 and preferably 60,000 to 300,000 and about 35 to 55 percent by weight of a vinyl solution polymer, all in an organic solvent. The nonfunctional polyurethanes are thermoplastic polyesterurethanes devoid of reactive isocyanate and hydroxyl groups and are derived from monomeric polyisocyanates and polyhydroxy compounds chain-extended with a low molecular weight diol, preferably a cycloaliphatic diol, to the desired molecular weight. When the polyhydroxy compound is a polycaprolactone polyol, it is essential that chain extension be effected with a cycloaliphatic diol, preferably dimethylolcyclohexane. When the polyhydroxy compound is a polyester polyol other than polycaprolactone polyols, it is essential that the polyester be derived from a polycarboxylic acid component comprising at least 30 mol percent, based on total mols of polycarboxylic acid employed in preparing the polyester, of at least one aromatic carboxylic acid. Polycaprolactone polyols can also be reacted with a polycarboxylic acid component comprising at least 30 mol percent aromatic polycarboxylic acid, in which case chain extension need not be effected with a cycloaliphatic diol. Especially preferred thermoplastic polyurethanes are obtained from the condensation of monomeric polyisocyanates and polyester polyols having an aromatic polycarboxylic content of at least 30 mol percent chain-extended with low molecular weight cycloaliphatic diol. The adhesives have activation temperatures as low as about 260.degree. F. (ca. 125.degree. C.) which makes them particularly suitable for laminating vinyl films of 6 mils thickness or less to metals without distortion or loss of any embossing or printed decoration on the film.

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