Method of laser trimming in semiconductor wafer

Details Method of laser trimming in semiconductor wafer Method of laser trimming in semiconductor wafer

1985-11-06

1987-07-07

Albritton, C. L.

Electric heating

Metal heating

By arc

219121LQ, 219121LY, B23K 2600

Patent

active

046788891

ABSTRACT:
A method of laser trimming in a semiconductor wafer, and more particularly, a method of laser trimming for disconnecting programmable links by use of a laser beam which links are provided within a multiplicity of semiconductor integrated circuit elements formed in the semiconductor wafer.

REFERENCES:
patent: 3584183 (1971-06-01), Chiaretta et al.
patent: 4240094 (1980-12-01), Mader

Affiliated with

Also associated with

Rating

Method of laser trimming in semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of laser trimming in semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of laser trimming in semiconductor wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1663934