Direct jump engineering change system

Details Direct jump engineering change system Direct jump engineering change system

1992-12-02

1994-10-11

Tolin, Gerald P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 174262, 361760, 361767, 361785, H05K 100

Patent

active

053549554

ABSTRACT:
A multi-layer interposer in which the X-Y engineering change wiring pattern in the interposer terminates in a pattern of pads on the upper surface of the interposer around the periphery of the chip. In order to make an engineering change, a jumper wire connect pads on adjacent interposers mounted on the multi-chip module.

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patent: 5243140 (1993-09-01), Bhatia
patent: 5294754 (1994-03-01), Wu

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